Compare with Applied Materials, Inc. 4.0% 15-JAN-2031
Key terms
Bond info
Sector
Producer Manufacturing
Industry
Industrial Machinery
Home page
ISIN
US038222AT25
CUSIP
038222AT2
FIGI
BBG01X9WCS38
Identifiers
ISIN US038222AT25
Applied Materials, Inc. engages in provision of materials engineering solutions used to produce semiconductors. The firm also focuses on design, development, production, and servicing of the critical wafer fabrication tools used for customers to manufacture semiconductors. It operates through the following segments: Semiconductor Systems and Applied Global Services (AGS). The Semiconductor Systems segment includes designing, development, manufacturing and sale of equipment used to fabricate semiconductor chips referred to as integrated circuits. The AGS segment engages in provision of services, spares, and factory automation software to customer fabrication plants globally. The company was founded on November 10, 1967 and is headquartered in Santa Clara, CA.
Classification
Sign up to see advanced bond data
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.