Applied Materials, Inc. 4.35% 01-APR-2047Applied Materials, Inc. 4.35% 01-APR-2047Applied Materials, Inc. 4.35% 01-APR-2047

Applied Materials, Inc. 4.35% 01-APR-2047

Compare with Applied Materials, Inc. 4.35% 01-APR-2047



Key terms


Outstanding amount
‪1.00 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
4.35%
Coupon frequency
Semi-annual
Maturity date
Apr 1, 2047
Term to maturity
20 years

Details


Sector
Producer Manufacturing
Industry
Industrial Machinery
Issue date
Mar 31, 2017
ISIN
US038222AM71
CUSIP
038222AM7
FIGI
BBG00GBPRXM0
Identifiers
ISIN US038222AM71
CFI code
DTFNGR
Applied Materials, Inc. engages in provision of materials engineering solutions used to produce semiconductors. The firm also focuses on design, development, production, and servicing of the critical wafer fabrication tools used for customers to manufacture semiconductors. It operates through the following segments: Semiconductor Systems and Applied Global Services (AGS). The Semiconductor Systems segment includes designing, development, manufacturing and sale of equipment used to fabricate semiconductor chips referred to as integrated circuits. The AGS segment engages in provision of services, spares, and factory automation software to customer fabrication plants globally. The company was founded on November 10, 1967 and is headquartered in Santa Clara, CA.
Sign up to see advanced bond data
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.