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Applied Materials, Inc. 5.1% 01-OCT-2035Applied Materials, Inc. 5.1% 01-OCT-2035Applied Materials, Inc. 5.1% 01-OCT-2035
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Applied Materials, Inc. 5.1% 01-OCT-2035

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Key terms


Outstanding amount
‪500.00 M‬ USD
Face value
1,000.00 USD
Minimum denomination
2,000.00 USD
Coupon
5.10%
Coupon frequency
Semi-annual
Maturity date
Oct 1, 2035
Term to maturity
8 years

Bond info


Issuer
Applied Materials, Inc.
Sector
Producer Manufacturing
Industry
Industrial Machinery
Home page
appliedmaterials.com
Issue date
Sep 24, 2015
ISIN
US038222AK16
CUSIP
038222AK1
FIGI
BBG00B2HTP44
Identifiers
ISIN US038222AK16
CFI code
DTFNGR
Applied Materials, Inc. engages in provision of materials engineering solutions used to produce semiconductors. The firm also focuses on design, development, production, and servicing of the critical wafer fabrication tools used for customers to manufacture semiconductors. It operates through the following segments: Semiconductor Systems and Applied Global Services (AGS). The Semiconductor Systems segment includes designing, development, manufacturing and sale of equipment used to fabricate semiconductor chips referred to as integrated circuits. The AGS segment engages in provision of services, spares, and factory automation software to customer fabrication plants globally. The company was founded on November 10, 1967 and is headquartered in Santa Clara, CA.

Classification


Placement type
Maturity type
Duration type
Long-term
Issue allocation
Conversion option
Sinking fund
Ownership form

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