Unisem (M) Bhd. engages in the manufacture of semiconductor devices. It operates through the following geographical segments: Asia, Europe, and United States of America. It offers laminated, lead frame, and leadless packages as well as micro-electro-mechanical systems and wafer level packaging services. The company was founded by Mong Tet Chia, Yee Loh Tee, and Colin Garfield Macdonald on June 19, 1989 and is headquartered in Kuala Lumpur, Malaysia.