T-Mobile USA, Inc. 4.8% 15-JUL-2028T-Mobile USA, Inc. 4.8% 15-JUL-2028T-Mobile USA, Inc. 4.8% 15-JUL-2028

T-Mobile USA, Inc. 4.8% 15-JUL-2028

In-depth bond breakdown



Key facts


Issue date
May 11, 2023
Maturity date
Jul 15, 2028
Outstanding amount
‪900.00 M‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
4.80% (Fixed)
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
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