Get started
MMM

Mobius Merger Sub, Inc. 9.0% 01-JUN-2030

No trades
See on Supercharts
Overview
Analysis

MGSI5597044 chart


Full chart

Key terms


Outstanding amount
‪500.00 M‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
9.00% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
9.50%
Maturity date
Jun 1, 2030
Term to maturity
5 years

About Mobius Merger Sub, Inc. 9.0% 01-JUN-2030


Issuer
Mobius Merger Sub, Inc.
Sector
Finance
Industry
Financial Conglomerates
Issue date
Jun 1, 2023
FIGI
BBG01GN87HT4
Mobius Merger Sub, Inc. is based in Wilmington, DE. Part of MOBIUS PARENT CORP., Mobius Merger Sub, Inc. is a company that provides financial solutions.

MGSI5597044 analysis


Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.