TTT

T-Mobile USA, Inc. 6.0% 15-JUN-2054

No trades
See on Supercharts
Overview
Analysis

Key terms


Outstanding amount
‪1.00 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
6.00% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
5.75%
Maturity date
Jun 15, 2054
Term to maturity
29 years

About T-Mobile USA, Inc. 6.0% 15-JUN-2054


Issuer
T-Mobile USA, Inc.
Sector
Communications
Industry
Wireless Telecommunications
Home page
Issue date
Sep 14, 2023
FIGI
BBG01J96XMY2
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.