Get started
T-Mobile USA, Inc. 4.85% 15-JAN-2029T-Mobile USA, Inc. 4.85% 15-JAN-2029T-Mobile USA, Inc. 4.85% 15-JAN-2029

T-Mobile USA, Inc. 4.85% 15-JAN-2029

OverviewAnalysis

In-depth bond breakdown


OverviewCouponRedemptionRisks

Key facts


Issuer
T-Mobile USA, Inc.
Issue date
Jan 12, 2024
Maturity date
Jan 15, 2029
Outstanding amount
‪1.00 B‬ USD
Face value
1,000.00 USD
Minimum denomination
2,000.00 USD
Coupon
4.85% (Fixed)
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.