603499 fundamentals
SHANGHAI SUNGLOW PACKAGING TECHNOLO dividends overview
The last dividend per share was 0.03 CNY. As of today, Dividend Yield (TTM)% is 0.23%.
Last ex-date
Last pay date
Dividend amount0.03CNY
Dividend yield TTM0.23%
0.00%
0.15%
0.30%
0.45%
0.60%
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
0.00
0.01
0.03
0.04
0.06
Dividends per share (FY)
Dividend yield (FY) %
Currency: CNY
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
Dividends per share (FY)
0.06
0.00
0.00
0.01
0.06
Dividend yield (FY) %
0.50
0.00
0.00
0.20
0.51
Payout ratio (FY) %
76.60
0.00
—
22.09
143.98
Dividend payout history
Ex-date
Record date
Pay date
Amount
Frequency
Jul 12, 2024
Jul 11, 2024
Jul 12, 2024
0.030
Final
Sep 19, 2023
Sep 18, 2023
Sep 19, 2023
0.025
Interim
Jun 28, 2023
Jun 27, 2023
Jun 28, 2023
0.015
Annual