ASE TECHNOLOGY HOLDING CO LTD
NYSE
ASX

ASX
ASE TECHNOLOGY HOLDING CO LTD
NYSE
 
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Financials

Valuation
Enterprise Value/EBITDA, TTM
Enterprise Value, FQ
Market Cap — Basic
Number of Employees
Number of Shareholders
Price/Earnings, TTM
Price/Revenue, TTM
Price/Book Ratio, FY
Price/Sales Ratio, FY
Balance Sheet
Current Ratio, FQ
Debt to Equity, FQ
Net Debt, FQ
Quick Ratio, FQ
Total Assets, FQ
Total Debt, FQ
Operating Metrics
Return on Assets, TTM
Return on Equity, TTM
Return on Invested Capital, TTM
Revenue per Employee, TTM
Price History
Average Volume (10 day)
Beta - 1 Year
Price - 52 Week High
Price - 52 Week Low
Dividends
Dividends Paid, FY
Dividends per Share, FY
Expected Annual Dividends
Dividends Yield
Margins
Net Margin, TTM
Gross Margin, TTM
Operating Margin, TTM
Pretax Margin, TTM
Income Statement
Basic EPS, Net Income
Earnings per Share, Basic, TTM
EBITDA, TTM
Gross Profit, FY
Last Annual EPS
Last Annual Revenue, FY
Net Income, FY
Total Revenue, FY
Free Cash Flow, TTM

Profile

Sector: Electronic Technology
Industry: Semiconductors
Employees: ---
ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. The firm develops and offers turnkey solutions for the front-end engineering test, wafer probing and final test, as well IC packaging, materials and electronic manufactures services. It operates through the following segments: Packaging, Testing, Electronic Manufacturing Services (EMS), Estate and Others. The Packaging segment offers a broad range of package types such as flip-chip BGA, flip-chip chip scale packages, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier, quad flat no-lead packages, advanced quad flat no-lead packages and plastic BGA. The Testing segment provides complete range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/RF/(2.5D/3D) module and SiP/ MEMS/Discrete and other test-related services. The EMS segment consists of the SMT assembly line which provides activities such as, solder paste stencil printing, component placement, and solder reflow. The company was founded in April 2018 and is headquartered in Kaohsiung, Taiwan.

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