GRIPM Advanced Materials Co., Ltd. engages in the design, research, development, production, and sale of advanced non-ferrous metal powder materials. It offers high-end microelectronic tin-based solder powder materials, 3-dimension printing powder materials, as well as copper-based metal powder materials such as electrolytic copper metal powder materials and atomized copper-based metal powder materials. The company was founded on March 4, 2004 and is headquartered in Beijing, China.